Cu/ITO/PET柔性薄膜的制备和弯曲性能研究

Preparation and Bending Properties of Cu/ITO/PET Flexible Films

  • 摘要: 采用磁控溅射法制备了Cu/ITO/PET柔性薄膜,并搭建了力学测试装置,对薄膜进行了弯曲和循环弯曲实验。使用四探针测试仪测试了不同工况下薄膜的方阻变化,通过扫描电子显微镜(SEM)观察了薄膜弯曲前后的表面形貌。结果表明,弯曲过程中,随着弯曲半径减小到7 mm,薄膜在内弯曲模式下的方阻发生显著变化。弯曲半径减小到3 mm时,薄膜在外弯曲模式下产生的裂纹比内弯曲更明显,方阻更大。弯曲半径为9 mm时,经过1500次循环弯曲,薄膜在内弯曲模式下产生了细微的裂纹,在外弯曲模式下没有观察到裂纹,内弯曲模式比外弯曲模式下的方阻更大。内弯曲半径和外弯曲半径从9 mm减小到3 mm时,薄膜方阻相对变化率在8%以内。内、外弯曲半径均固定为9 mm时,经过6组弯曲实验,薄膜方阻相对变化率均在6%以内。制备的柔性薄膜具有良好的导电和耐弯曲性能。

     

    Abstract: Cu/ITO/PET flexible films were fabricated using magnetron sputtering, and a mechanical testing device was set up to conduct bending and cyclic bending experiments on the films. The sheet resistance variations of the films under different bending conditions were measured by a four-probe tester, and the surface morphologies of the films before and after bending were observed via scanning electron microscopy (SEM). The experimental results reveal the following: During the bending process, as the bending radius decreases to 7 mm, the sheet resistance of the film changed significantly under the inner bending mode. When the bending radius is further reduced to 3 mm, more obvious cracks form on the film surface under the outer bending mode compared with the inner bending mode, resulting in a larger sheet resistance. At a bending radius of 9 mm, after 1 500 cycles of cyclic bending, subtle cracks appear in the film under the inner bending mode, while no cracks are observed under the outer bending mode. Notably, the sheet resistance under the inner bending mode is larger than that under the outer bending mode. When the inner and outer bending radii decrease from 9 mm to 3 mm, the relative variation rate of the sheet resistance remains within 8%. When both the inner and outer bending radii are fixed at 9 mm, after six groups of bending experiments, the relative variation rate of the sheet resistance is within 6% for all groups. Overall, the prepared flexible films exhibit excellent electrical conductivity and bending resistance, demonstrating their potential applications in flexible electronic devices requiring mechanical flexibility and stable electrical performance. The comprehensive analysis of sheet resistance variations and surface morphologies under different bending conditions provides a theoretical basis for the design and optimization of flexible conductive films in practical engineering applications.

     

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