SiC薄膜材料理论模拟研究的动态

THE DEVELOPMENT OF SIC FILMS IN SIMULATION

  • 摘要: SiC因其宽的禁带宽度、高的电子饱和速度、大的临界击穿场强、高的热导率和热稳定性等特性而成为制作高频、大功率和耐高温器件的理想材料。综述了SiC材料的理论研究现状和发展趋势,并对研究方法和结果进行了简要的评述。

     

    Abstract: Silicon carbide(SiC) is a promising material for high power,high frequency,high temperature applications because of its excellent properties such as wide band gap,high saturated electron velocity,high electrical breakdown field,high thermal conductivity,thermal stability and so on.Theoretical research status and developing trends on SiC material are summarized in this paper.Also the methods and results are reviewed.

     

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