Progress on Effects of Deposition Processing Parameters on Coatings Deposition Rate for Arc Ion Plating
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Graphical Abstract
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Abstract
As one of most industrial applications of vacuum coating technology,cathodic arc ion plating technology has obtained the rapid development in recent years.But there are still some technical problems which have not been fully resolved,such as large particle pollution,large residual stress for the deposition of coating,and not being realized low temperature deposition,etc.On the other hand,the deposition efficiency of arc ion plating remains to be improved,although it has much higher deposition rate than that magnetic sputtering both of which belongs to the same physical vapor deposition technology,But for large thickness of coatings(more than 20 microns or even 50 microns),its usual deposition rate(generally in the range of 1 to 10 μm/h)still need a very long time.Aimed at this problem,this present work summarizes the effects of different process parameters on deposition rate,and the recent progress in the arc ion plating technology for improving the deposition rate was summarized,in order to provide certain technological support for the development of the technology.
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