Investigation of burnout mechanism in microwave GaAs power FETs:PartⅠ.D.C. burnout
 
                 
                
                    
                                        
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Graphical Abstract
 
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Abstract
    Microwave GaAs power FET chips fabricaled by us which appear D.C. burnout during the testing arc investigated by means of scann-ing electron microscopy(SEM)and Auger microprobe(SAM),the physics procedure and mechanism of D.C. burnout are analyzed.
 
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