INVESTIATION TECHNIQUE Mg-DOPING OF IMPROVEMENT GaN MATERIAL
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Graphical Abstract
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Abstract
Two to five micrometer thick P-AlxGa1-xN/GaN layers with 0<x≤0.4 were grown by low-pressure metal organic chemical Vapour deposition on sapphire(0001)substrates.For Al concentrations 0.2<x<0.7 in the AlxGa1-xN layers,the orthogonal-design method is employed to optimize the growth parameters of p-typed GaN,such as the Mg flux,growth temperature,and Ⅴ/Ⅲ ratio.It is found that the hole concentration is reduced by excessively high Mg flux,high growth temperature,and great Ⅴ/Ⅲ ratio.The influence of the annealing temperature on the hole concentration and photoluminescence of p-typed GaN is also studied.The optimum annealing temperature is between 680℃and 750℃.
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