EXPERIMENTAL INVESTIGATION ON THERMAL CONTACT RESISTANCE OF AlN AND OFHC-Cu CONTACT AT LOW TEMPERATURE

The influence of interfacial temperature and contact pressure on thermal interfacial resistance is experimentally studied by one-dimensional steady state heat conduction. In range of temperature（90～210 K） and contact pressure （0.273～0.985 MPa）, thermal contact resistance of AlN/OFHC-Cu decrease with a increasing contact pressure, and with a increasing contact temperature by the intensive movement of heat carrier. When the temperature of interface is higher, the change rate of thermal contact resistance as contact pressure become more swift.